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Wafer Probes
I/O pad contactor held by probe card or flying.
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probers, Wafer Inspection
- Pickering Interfaces Inc.
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LXI WTB Probe, Thru connect, DC coupled
60-981-001
The 60-981 LXI Wired Trigger Probe provides a simple method of monitoring the LXI Wired Trigger Bus activity. It provides a through line active probe that can be used to non-intrusively monitor the waveforms of the M-LVDS drivers on all 8 channels. Each channel has two single ended outputs from the differential pair that can be subtracted by an oscilloscope to display each driver output and the differential signal.
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Cantilever Probe Card
MPI Cantilever Probe Card is widely applied on gold bump and pad wafer testing for display driver, logic, and memory device. MPI’s cantilever probes are the corresponding answer to the demands of fine pitch, small pad size, high speed, less cleaning, multi-DUT, high pin count, and ultra-low leakage requirements. With outstanding craftsmanship, innovative architecture and proven methodologies based on mechanical and electrical simulation/measurement results, making MPI the top cantilever provider worldwide.
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Test Contactor/Probe Head
cBoa
cBoa™ test contactors and probe heads are the solutions for contacting high-frequency devices for package test or final test at wafer. The robust design and materials of the cBoa probe withstand the rigors of high-volume test by providing longer life and higher yield. The homogeneous DUT side plunger provides longer run times between cleaning and increased probe life.The cBoa features a stainless-steel spring for tri-temp testing and performs in operating temperatures of -55°C to +155°C and bandwidth of up to 35 GHz @ -1 dB.
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MPI SiPH Probe Systems
MPI Advanced Semiconductor Test
MPI designed dedicated SiPH upgrades for its well known 200 and 300 mm probe systems, which includes:*Various options of high-precision fiber alignment systems for ultra-fast scanning routines*Multiple measurement capabilities for O-O, O-E, E-O and E-E device configuration*Integrated Z-sensing for detecting the fiber to wafer contact point*Crash protection when using two optical fiber arms*Wide temperature range from -50°C to 200°C*Optional dark box for testing in light tight environment*Extensive software package for supporting easy integration to operator’s test executive*Probe system compatibility: TS2000-IFE, TS2000-SE, TS3000, TS3000-SE, TS3500 and TS3500-SE
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ResMap or DualMap Auto Load Floor Standing
Creative Design Engineering, Inc.
*Type: Floor Standing*Wafer load: FOUP LoadPort*Wafer size: 300mm, 8" and 300mmopen cassette with adapter*Mini Environment: yes*Probe Changer: 1,2 or 4 probes*Aligner: yes*Range: 1m/ to 10M/*Accuracy:0.5%*Repeatability: 0.02% *Static Repeatability: 0.1% dynamic
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Quick Silicon Discriminator
HS-QSD
HS-QSD Quick Silicon Discriminator is specially designed for silicon sorting，it can quickly test the silicon type, heavy-dopedt, and can be widely used in all kinds of silicon sorting, like granular polysilicon material, break semiconduct silicon wafer, chunk material, top and tail material and so on. With the three probes, it could show type and heavy type simultaneously, strongly improved the sorting efficiency.
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Probe Card
T90™ Series
The 90 mm tile was designed for mounting on a standard 4.5″ probe card holder for multi-site wafer level reliability testing. The 1.6 mm (0.062″) thick rails allow the chassis to slip into planarity adjustable probe card holders for most analytical probe stations.
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Cryogenic Probe Station
FWPX
Lake Shore’s FWPX probe station is designed for researchers who require large-size wafer probing. The FWPX accommodates wafers up to 102 mm (4 in) in diameter and can be modified to accept up to 152 mm (6 in) wafers. This general-purpose probe station is designed for researchers or engineers conducting material characterization tests over large samples. It is also an effective unit for measuring organic materials.
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Light and Energy Meter
Model 659
UV Light and Energy Meter for use with all wafer steppers. For over 45 years, OAI is a world leader in UV Light and Energy Measurement Instrumentation used for reliable accurate calibrated control of the photolithography processes in the Semiconductor, MEMS, Wafer Packaging and Wafer Bumping Industries. The New Model 659 is an advanced UV exposure analyzer specifically designed for use with all wafer steppers including high intensity wafer steppers. This meter averages up to 400 exposure readings, has Ethernet and USB interface for downloading recorded measurements, and has intensity range of up to 7,500mW/cm2. Probes are available in wavelength of 365nm, 400nm, 420nm & 436nm. OAI has a complete certified calibration lab to maintain the performance, quality and reliability of our meters. The Model 659 meter is traceable to NIST standards.
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WAFERMAP
WAFERMAP is an award winning software package used to collect, edit, analyze and visualize measured physical parameters on semiconductor wafers. WAFERMAP can import data files from various metrology tools such as ellipsometers, thickness gauges and four point probes. The imported data can then be visualized or printed as line scans, contour plots, 2D or 3D plots or as a histogram.
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Low-leakage Switch Matrix Family
Conducting all the parametric measurements necessary for the numerous test structures on a semiconductor wafer can be a time-consuming and expensive process. With the cost of end-user devices continuing to drop, even laboratory characterization environments must reduce the cost of test. Until now engineers and scientists working on current and future semiconductor process technologies were faced with a difficult choice: either use a semiconductor parameter analyzer with positioners on a wafer prober, which limits the ability to perform automated test, or use a switching matrix and probe card, which reduced the analyzer's measurement resolution. Utilizing a switching matrix with a semi-automatic or fully-automatic wafer prober enables characterization tests to be automated, eliminating the need to have an operator manually reposition the probes each time a new module needs to be tested. This reduces both test time and cost. Due to the many price/performance points available, Keysight's switching matrix solutions provide the flexibility to choose exactly what your testing needs require, without overspending.
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Semi-Automated Probe Stations
SPS 2600, SPS 2800, and SPS 12000 Series
The SPS 2600, SPS 2800, and SPS 12000 Series systems are MicroXact’s semi-automated probe stations designed to be flexible and easy to use when performing high productivity device characterization, wafer level reliability testing and failure analysis. These semi-automatic probe station systems are designed to support manual and semi-automatic probing of up to 200mm wafers.
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Test Contactor/Probe HEad
cRacer
The cRacer™ test contactor and probe head portfolio offer solutions for 5G mmWave FR2 up to 54+ GHz.cRacer utilizes robust spring probe technology for testing singulated packages or probe heads for wafer probe (bumped/pad) applications with fine pitch and WLCSP compatibility – ranging from 100 µm to 650 µm, covering the majority of 5G devices.cRacer features a stainless-steel spring for tri-temp testing and performance in operating temperatures -55°C to +155°C.
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Probe Needles for Wafer Sort and Test Applications
Advanced Probing Systems, Inc.
APS is the global leader in the manufacture of probe needles used in cantilevered probe cards. All probe needles used in wafer sort are manufactured according to customer specifications using stringent in-process quality assurance procedures.
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Production Wafer Level Burn-in
TV19 VersaTile™ probe cards are designed with Celadon’s patented ceramic technology for superior electrical performance, yet is highly modular due to it’s 28mm x 28mm chassis. Micro-adjustments can be made in seconds with an allen wrench and a microscope. Easily align VersaTile cards for different wafer layouts using a 4.5” compatible 1×3 , 200mm, or 300mm VersAdjust plate.
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Multisite Probe Card
T300 ButtonTile™
The Celadon T300™ probe cards are designed for long-term, multi-site, high-density wafer level reliability or burn-in tests up to 400°C. In today’s economic environment, conventional reliability data is needed quickly while eliminating the cost, electrical stress, and delay of parts packaging while maintaining a wafer performance map.
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Optoelectronics and Photonics
SemiProbe has developed probe stations for a wide variety of optoelectronic and photonic device applications, including light emitting diodes (LEDs), vertical cavity surface emitting lasers (VCSEL) and photo diodes. Testing and handling small, fragile, thin wafers with thousands of die on them poses unique challenges that require innovative solutions.
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MANIFULATOR
As one of the most important module in Probe_Station, manipulator is an accurate system that probe micro distance() and contact on the electrode of semiconductor wafer, device. ECOPIA's Manipulator is very easy to use and probe arm's elastic plate is good to protect sample's surface, from being damaged by Z direction movement.
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Four-Point Probe
Materials Development Corporation
Materials Development Corporation offers the complete line of Four Point Probe systems from AIT. Systems are available to measue up to 12" diameter (300 mm) wafers as well as specialty systems for Photovoltaic wafers and substrates. For more information on these systems, contact MDC.
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Probe Cards
Minitile™ with Advanced Cantilever™ technology and WedgeTile™
Each probe is designed for wide temperature ranges and so the probe expansion characteristics are closely matched to the wafer’s expansion characteristics. This allows the user to take a fast measurement while a system is in a settling or thermal stabilization mode and helps compensate for wafer expansion.
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Advanced Probe Card / V type
VC Series
Japan Electronic Materials Corp.
*Vertical contact Probe Card*No limitation by Pad layout*Large probe area (Suitable for 200mm wafer 1-shot)*Small scrub mark*Suitable for High/Low Temperature Test
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Wafer Probe Test System
STI3000
The STI3000 is a wafer-level MEMS and mixed signal ASIC probe test system that combines several functional STI test equipment blocks for testing gyros, accelerometers, pressure sensors, microphones, resonators, and mixed signal ASICs.
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Wafer Probers
Full Automatic Wafer Prober. Semi Automatic Wafer Prober. High Current Probe Block. 6-inch Manual Prober. 8-inch Manual Prober. 12-inch Manual Prober.
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High Power Devices
SemiProbe configures our PS4L Adaptive Architecture into the Voltarus (TM) family of probe stations to fulfill the unique requirements of testing high power devices at wafer level prior to packaging. Voltarus probe stations are available in manual, semiautomatic, and fully automatic configurations that can test and characterize power devices up to 10 KV or 200 Amps (pulsed).
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ResMap or DualMap Auto Load Table Top
Creative Design Engineering, Inc.
*Type: Table Top*Wafer load: open cassette*Wafer size: 4" to 8"*Mini Environment: N/A *Probe Changer: N/A *Aligner: N/A*Size: 12" x 28" x 10"*Range: 1m/ to 10M/*Accuracy: 0.5%*Repeatability: 0.02% *Static Repeatability: 0.1% dynamic
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IC Test Services
With knowledge gathered from decades of supporting Tier 1 and emerging industry leaders, Amkor understands test solutions must address advanced technology, quality, performance and cost of test. We offer full turnkey solutions including wafer processing, advanced bump, wafer probe, assembly, final test, system-level test, burn-in and end-of-line services.
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Probe Cards
Direct Dock
Direct dock style wafer probing allows for a higher bandwidth, increased pin density and testing more devices in parallel. Direct dock probe cards also support the growing movement of traditional final test to wafer probe which allows for known good die (KGD) and reduced cost of ownership.
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Probe Card
Japan Electronic Materials Corp.
The probe card is a tool for testing semiconductors used at "Wafer Test" to check quality of IC or LSI in the first process of semiconductor manufacturing. The probe card is expendable.
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Conductivity Type (P/N) Checker By Contact Thermo-electromotive Force Method (seebek Effect)
PN-12α
*Thermo electrode and cold electrode is mounted detecting part of measuring probes*Possible to check most figure of sample such as single crystalline silicon wafer, bulk, ingot and so on*Please select from 2 types;1) 2 probe ver.(Hot probe, Cold probe),2) 1 probe ver.(Hot & Cold probe)
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Fully Automatic 4 Point Probe System for Silicon Wafer
WS-8800
*Measurement of resistivity, thickness, conductivity(P/N) and temperature*Tester self-test function, wide measuring range*Thickness, measurement position and temperature correction function for silicon resistivity*Number of cassette station can be changed by customers request*Host (CIM) communication and SMIF or FOUP compatible
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Wafer Sort
TestEdge offers complete wafer sort solutions. Our range of wafer sort capabilities demonstrates our ability to handle a wide range of devices and device characteristics. State of the art Electroglas probers Sort experience with high probe count Less than 4 mil pitch on probes Experience with C4 Bump and Aluminum pad Experience on Bipolar, CMOS, GaAs, & SiGe Overhead sort or cable harness sort Microsite testing capability
