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3D Automated Optical Inspection System
EAGLE 3D 8800 SERIES
EAGELE 3D 8800 AOI applies 8-way projection for 3Dmeasurements to all models, minimizing shadow effectserrors and performing 100% 2D&3D examinations simultaneouslyin all FOV areas.
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DSP-Based 4/8-Axis Advanced Pulse-Train Motion Controllers
AMP-204C/AMP-208C
ADLINK"s new AMP-204C/AMP-208C DSP-based 4/8-axis advanced pulse-train motion controllers incorporate up-to-date floating-point DSP and FPGA technology, enabling high pulse output and encoder input frequency up to 6.5 MHz and 20 MHz respectively. Leveraging ADLINK" s Softmotion technology, the AMP-204C/AMP-208C offer impressive comprehensive and application-oriented motion functionality to reduce development time while maintaining superior throughput and accuracy. Superior synchronous motion control performance combines with point-table function integrating multi-dimensional interpolation, such as 3D linear/circular/spiral interpolation with enhanced trajectory and velocity planning, for contouring applications in semiconductor, display and conventional manufacturing industries. The AMP-204C/AMP-208C also support PWM control with three different control modes for frequency or duty cycle, benefiting laser engraving/marking/cutting applications. Moreover, hardware-based position comparison and trigger output are applicable in AOI applications.
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Entry Level AOI
iSpector
The Mek iSpector series AOI machines are fully compatible with Mek’s Catch System for classification, repair and SPC, utilizing the same powerful 22X software that is used in the premier Mek PowerSpector series. There is no compromise on the wide range of inspection algorithms and component libraries.
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AOI & SPI, Test Systems
SigmaX SPI
Most defects in the circuit-board assembly are due to the solder paste or the process of printing solder paste. Since the transition to lead-free soldering, a whole new spectrum of problems has emerged in older paste printing and its due processes. Incomplete coalescence of ball grid array (BGA) spheres and solder paste deposits are failure modes that have increased in frequency since the transition to lead-free soldering. The SigmaXs inspection technology is unaffected by varying materials, surface conditions, or colors. The system profiles the board to generate accurate 3D shapes far superior to other brands and technologies.
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Flying Probe Test Systems
Flying probe testers work by In-circuit testing the board via a number of moving test probes. They have the advantage over traditional In-circuit testers of not requiring a dedicated "bed of nails" test fixture thus reducing the price for each different board being tested. However, modern Flying Prober testers offer so much more than just In-circuit testing. They enable the user to combine In-circuit, AOI, Functional, Device Programming and Boundary Scan testing, in one test system.
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Mek Selective 3D AOI
Every one of our desktop AOI and inline AOI systems is optimised for the demands of today’s advanced SMT applications and critical manufacturing environments. All are capable of delivering Selective 3D, using our unique stereoscopic imaging from the 9 cameras of the GTAz /GDAz optical heads.
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Automated Optical Inspection (AOI)
Automated optical inspection (AOI) is an automated visual inspection of printed circuit board (PCB) (or LCD, transistor) manufacture where a camera autonomously scans the device under test for both catastrophic failure (e.g. missing component) and quality defects (e.g. fillet size or shape or component skew). It is commonly used in the manufacturing process because it is a non-contact test method.
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Automated Optical Inspection
K Series3D
K Series and K Series3D are the reference in Automated Optical Inspection (AOI), allowing 2D and 3D inspection with very low false calls rate, for both pre-reflow and post-reflow. They are the most powerful gatekeepers to guarantee high quality level for the assembled PCB.
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Box IPC
These IPC are compact design with front I/O and aim at industrial automation and equipment manufacturing applications, such as machine vision and AOI.
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2D/3D AOI Series
MV-6e
- Exclusive10MP/18MPCameraTechnology- Precision Telecentric Compound Lens Design- Eight Phase Color Lighting System- 10MP / 18MP SIDE-VIEWER® Camera System- Extremely Simple Programming and Operation- Integrated INTELLI-SCAN® Laser Inspection System- 3D Co-Planarity Inspection of Gull-Wing Leads, BGA and CSP - - -- Devices- Enhanced 3D Solder Paste Height Measurement Capability- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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Microelectronics And Packaging AOI
Machine Vision Products, Inc. has extensive experience in a wide range of Microelectronics and Packaging applications. MVP works with the world’s leading manufacturers on a global basis. From multiple die and wire technologies to leadframe, ball grid array and surface inspection applications, MVP has the widest applications toolbox of any AOI provider. MVP takes pride in the fact that they supply many complex inspection solutions to diverse industries such as Automotive, Telecoms, Medical Devices, Military, and Space. MVP’s 900 Series is the base platform upon which all Microelectronics and Packaging inspection solutions are based. The 900 series 2D capabilities provide metrology and defect detection using a propriety Quad-Color lighting, Telecentric optics and resolutions down to 1um. 3D height measurement capabilities allow for in-line high speed inspection of Dies, paste deposition, positional accuracy, volume and height with a resolution down to 1.13um.
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Advanced 4-CH Encoder Card With High-Speed Triggering Function
LPCIe-8124-C
The LPCIe-8124-C delivers versatile position comparison & high speed trigger output, making it ideal for a wide range of applications such as AOI and distance measurement. With a PCIe interface, LPCIe-8124-C is compatible with a wide variety of high performance systems.
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4-Channel High Speed Position Comparison And Trigger Module
ECAT-TRG4
The ECAT-TRG4 is EtherCAT SubDevice module with high-speed position comparison trigger and encoder single redriver function, helping machine and equipment builders to use multiple triggers simultaneously for AOI, glue dispensing, display tests, and storage assembly applications.
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2U 2 GPUs AI GPU Server
AXE-7220SR
- Advanced Computing Power: Featured 4th Gen Intel® Xeon® Scalable Processor to provide edge AI power computing power- High flexibility of PCIe configurations: Up to 5x PCIe x8 or 2x PCIe x16- 5G ready: Support 5G SIM card- Short-depth chassis design: Compact size 45cm only- Applications: Manufacturing-AI AOI, Telecom-AI RAN,Healthcare-CT/MRI/X-Ray image re-con, analysis, Broadcasting-- Digital transcoding
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3D Laser Sensors For Measuring By Laser Triangulation
C5-CS series
3D sensors with integrated laser electronicsProfile resolution with up to 4096 points/profile (4K Ultra HD)*Integrated 3D evaluation algorithms with up to 200 kHz*Improved image recording quality through High Dynamic Range 3D (HDR-3D)Supports GigE Vision and GenICam standardRobust protective housing with IP67Industrial M12 connectorsService friendly designConnection for laser protection / emergency stop functionalitySupports 3D scan features such as autostart, automatic AOI tracking, automatic AOI search, etc.
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Automated Optical Inspection System
506
We are proud to introduce the latest member of our model 505 AOI product family, the 506. This system was developed to provide a high coverage, easy to program AOI system for the larger backplanes / backpanels being produced today.
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Automated X-ray Inspection (AXI)
Automated X-ray inspection (AXI) is a testing approach based on the same principles as automated optical inspection (AOI). Instead of cameras, X-rays are used to automatically inspect features.
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Software Products
Working on the premise to ease system operation, increasing inspection capabilities while providing full traceability MVP Software Products encompass a range of tools driven directly from the data generated at the AOI systems, as well as optional links back to the production lines and monitoring of the data they generate also.
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3D AOI Series
MV-7 OMNI
- Exclusive 15MP CoaXPress Camera System- OMNI-VISION® 3D Digital Tri-Frequency Moiré Technology- Leading-Edge 12 Projection Blue DLP Technology- Precision Compound Telecentric Camera Lens- Eight Phase Color Lighting System- 10MP / 18MP SIDE-VIEWER® Camera System- Programmable Z-Axis Multi-Focus System- INTELLI-PRO® Automatic Programming Software- Multi-Functional AOI-SPI Fusion Technology- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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4-in-1 AOI Solution
Ultra Dimension™ Series
ltra Dimension™ Automated Optical Inspection (AOI) Series for PCB production. Designed to meet the rigorous demands of advanced PCB manufacturing processes, the innovative Ultra Dimension is the first AOI solution to integrate four leading solutions - pattern inspection, laser via inspection, Remote Multi-Image Verification and 2D metrology - into a single system. This solution enables manufacturers to increase quality and yield as well as dramatically reduce their overall total cost of ownership (TCO), signifying a revolution in the AOI room workflow.
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Full 3D Inline Metrological & Imaging AOI
Metrological Full 3D AOI is achieved by measuring all 3 dimensions (X, Y and Height) to detect every measurable solder and component defect pre-reflow and/or post reflow soldering.
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Optical Inspection
3D AOI
In contemporary electronics manufacturing, automatic optical inspection (3D AOI) is an established component of quality control. A company purchasing a 3D AOI system wants to ensure that it is manufacturing its electronic products in the very best quality and can guarantee they will have a long service life. The Viscom systems feature superlative 3D and software attributes to deliver excellent measurement accuracy and exceptional image quality. Our 3D AOI systems are designed for simple programming and can also be flexibly adapted to new requirements, allowing them to easily accommodate fast product changeovers as well as large production quantities.
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SCANNER BASED IN-LINE & DESKTOP AOI
SS15000-PAL & SS15000-IL
AOI Systems ScanSpection uses two basic algorithm groups to inspect component and soldering. The first algorithm checks the component related parameters at once, with these being entered to a Model training phase. The second algorithm group is for solder and lead inspection and offers the ability to use the optimum algorithm for the type of inspection to be carried out. In addition the solder inspection and lead inspection can be attached to a package type rather than component type to assist in programming.
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3D AOI with Revolutionary New 3D Measurement
Zenith
The Zenith 3D AOI system measures the true profilometricshape of components, solder joints, patterns and even foreignmaterial on assembled PCBs with true 3 dimensional measurement, overcoming the shortcomings and vulnerabilities of 2D AOI.
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2-Phase Stepper Drives Based On EtherCAT Field Bus
Nu-Step DA Series
The ADLINK Nu-Step DA Series is a stepper driver based on the EtherCAT bus featuring a 32-bit ARM processor and advanced variable current and frequency conversion technology. The driver generates less heat and motor vibration for more stable operation. It not only supports the standard EtherCAT specification, but also supports table comparison triggers for automated optical inspection (AOI) and linear comparison triggers for line scanning.
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Advanced 4-CH Encoder Card with High-Speed Triggering Function
LPCIe-8124-C
The LPCIe-8124-C delivers versatile position comparison & high speed trigger output, making it ideal for a wide range of applications such as AOI and distance measurement. With a PCIe interface, LPCIe-8124-C is compatible with a wide variety of high performance systems.
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Inline AOI Machine
Sherlock-300I
Add PCB inspection to your automated production line, pre- or post-reflow, and speed up your process. Inline Sherlock 300I AOI system inspects components and solder joints on SMT, through-hole and mixed-technology boards and communicates with downstream equipment for automatic good/bad board sorting. The user interface is 100% touch control—as easy to use as a tablet.
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SMT AOI
All MVP products have the unique ability to be deployed in all inspection scenarios from Paste to Post Reflow without changing hardware, allowing maximum utilization of your investment. With Versa, Selecta, Spectra and GEM Platforms, MVP provides the AOI solutions to meet your production requirements.
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3D Automated Optical Inspection
Zenith UHS
High-speed full 3D AOI that brings about a revolution in SMT process management Industry-leading speed for full 3D measuring inspection equipment skill solutions- Only solution in the industry to set inspection criteria according to IPC-610 standards- Performs defect diagnosis through measurement-based data and eliminates the causes of possible errors- Powerful 3D solder joint inspection
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Packaging Manufacturing
KLA’s extensive portfolio of packaging solutions accelerates the manufacturing process for outsourced semiconductor assembly and test (OSAT) providers, device manufacturers and foundries for a wide range of packaging applications. Innovations in advanced packaging, such as 2.5D/3D IC integration using through silicon vias (TSVs), wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP) and heterogeneous integration as well as a wide range of IC substrates create new and evolving process requirements. KLA offers systems for packaging inspection, metrology, die sorting and data analytics focused on meeting quality standards and increasing yield before and after singulation. SPTS provides a broad range of etch and deposition process solutions for advanced packaging applications. Orbotech offers a portfolio of technologies that includes automated optical inspection (AOI), automated optical shaping (AOS), direct imaging (DI), UV laser drilling, inkjet/additive printing and software solutions to ensure manufacture of the highest quality of IC substrates.
