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- Pickering Interfaces Inc.
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PXI/PXIe MEMS Optical MUX, 8-Channel, Multi-Mode, 62.5/125 Fiber
40-852A-118-M62.5-HI
The 40/42-852A-118-M62.5-HI is a PXI/PXIe 8-channel multiplexer with FC/PC connectors, includes hardware interlock and is part of Pickering's range of PXI Fiber Optic MEMS Switching modules. They are available in many high density formats with a choice of different connector styles to suit most applications: FC/APC (for optimal performance), FC/PC and SC/PC for general applications and LC and MU for high density applications.
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3D Automated Optical Inspection System
EAGLE 3D 8800 SERIES
EAGELE 3D 8800 AOI applies 8-way projection for 3Dmeasurements to all models, minimizing shadow effectserrors and performing 100% 2D&3D examinations simultaneouslyin all FOV areas.
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Signal Integrity Test Products
S1
*Fixtureless Test Solution*Automated Optical Inspection*DC Electrical test*Tests any backplane – Small, large, simple, complex*Now available with 4 heads
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ROBOT-MOUNTED OPTICAL CMM 3D SCANNERS
METRASCAN-R
Part of the MetraSCAN 3D line-up, the robot-mounted MetraSCAN-R optical CMM 3D scanning systems are fast and accurate scanning solutions designed for 3D automated inspection of parts on the production line and on the shop floor. In combination with industrial robots, the MetraSCAN-R series increases the reliability, speed and versatility of on-line inspection and quality control (QC) process.
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GENERAL INSPECTION MACHINE AFTER SOLDER MASK
DVI is a technology of automated optical inspection, which can inspect deep to the difference from semi-transparent layers or semi-reflective layers.
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Automated Optical Inspection (AOI)
Automated optical inspection (AOI) is an automated visual inspection of printed circuit board (PCB) (or LCD, transistor) manufacture where a camera autonomously scans the device under test for both catastrophic failure (e.g. missing component) and quality defects (e.g. fillet size or shape or component skew). It is commonly used in the manufacturing process because it is a non-contact test method.
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Signal Integrity Test Products
RoBAT RCI
*TDR & TDT, Measurement Capabilities*Impedance, Skew, Backdrill measurements*Automated Optical Inspection*DC Electrical Test*Now available with 4 heads*24 port (1 port per channel) TDR/TDT unit*Future capabilities – Fully automated VNA test (4 port S-Parameter Measurement)
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Automated Optical Inspection
K Series3D
K Series and K Series3D are the reference in Automated Optical Inspection (AOI), allowing 2D and 3D inspection with very low false calls rate, for both pre-reflow and post-reflow. They are the most powerful gatekeepers to guarantee high quality level for the assembled PCB.
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3D Microscope
BVM-5006
BVM-5006 Electric 3D Microscope features the quality optical system, high resolution, large field of view, high zoom ratio, novel design and one-up technology, easy and automatic operations. Includes: Motorized zooming, motorized observation angle for changing and optional motorized focusing. The speed can be adjusted while changing observation angle. With the angle attachment, the microscope can realize 3D image effects for observing the components and deep holes. The LED lights can generate high brightness. Theoretically the service life of LED lights can reach 20,000 hours. The LED lights with area control function can illuminate from different angles for convenient multi-angle inspections. The M-N3D Microscope can be widely used in micro-electronics, automated monitoring and testing industries. By selecting the appropriate objectives and video couplers, different magnification, field of view and depth of field can be acquired. Digital and Analog video systems can meet the different users' demands.
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Ceramics and Glass Inspection Systems
Due to their special material properties, ceramic and glass components are the basis of many high-tech products. The same properties make the production complex and costly. Substrate defects that lead to failure of finished components should be avoided at all costs. For this reason, early automated optical inspection is essential.For the inspection of sapphire and quartz glass Intego has developed systems to detect both external and internal defects and can also provide cutting suggestions. Using index matching it is possible to test rough or uneven glass profiles.For the inspection of ceramic components Intego offers solutions specifically tailored to the respective testing task. Our modular design uses standard components that have already been developed and tested and in most cases only requires minimal adaptation.
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3D Automated Optical Inspection Systems (3D-AOI)
3Di Series
Saki’s 3Di Series applies cutting edge technologies to improve production efficiency and enhance production quality across the entire assembly line.
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Automated Optical Inspection System
506
We are proud to introduce the latest member of our model 505 AOI product family, the 506. This system was developed to provide a high coverage, easy to program AOI system for the larger backplanes / backpanels being produced today.
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Automated X-ray Inspection (AXI)
Automated X-ray inspection (AXI) is a testing approach based on the same principles as automated optical inspection (AOI). Instead of cameras, X-rays are used to automatically inspect features.
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4-in-1 AOI Solution
Ultra Dimension™ Series
ltra Dimension™ Automated Optical Inspection (AOI) Series for PCB production. Designed to meet the rigorous demands of advanced PCB manufacturing processes, the innovative Ultra Dimension is the first AOI solution to integrate four leading solutions - pattern inspection, laser via inspection, Remote Multi-Image Verification and 2D metrology - into a single system. This solution enables manufacturers to increase quality and yield as well as dramatically reduce their overall total cost of ownership (TCO), signifying a revolution in the AOI room workflow.
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Optical 3D Scanner
ATOS Core
ATOS Core is the specialist for the three-dimensional measurement of small components up to 500 millimeters in size. The sensor forms the basis for a diverse range of measuring tasks – from simple 3D scanning to fully automated measurement and inspection processes. The ATOS Core is used for the three-dimensional measurement of small and medium-sized objects such as ceramic cores, and cast or plastic parts. To capture also large objects of several meters in optimal workflows, the ATOS Core can be easily combined with digital photogrammetry of GOM's optical 3D coordinate measuring machine TRITOP.
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2-Phase Stepper Drives Based On EtherCAT Field Bus
Nu-Step DA Series
The ADLINK Nu-Step DA Series is a stepper driver based on the EtherCAT bus featuring a 32-bit ARM processor and advanced variable current and frequency conversion technology. The driver generates less heat and motor vibration for more stable operation. It not only supports the standard EtherCAT specification, but also supports table comparison triggers for automated optical inspection (AOI) and linear comparison triggers for line scanning.
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High-Accuracy Automated Optical Inspection Systems
Fully-automated and high-accuracy 3D inspection and measurement systems. High-power, long working distance optics and high-resolution digital camera are perfect for high-magnification applications. These are full-color systems capable of high-accuracy measurements, automated defect detection and color verification.
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3D Automated Optical Inspection
Zenith UHS
High-speed full 3D AOI that brings about a revolution in SMT process management Industry-leading speed for full 3D measuring inspection equipment skill solutions- Only solution in the industry to set inspection criteria according to IPC-610 standards- Performs defect diagnosis through measurement-based data and eliminates the causes of possible errors- Powerful 3D solder joint inspection
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Packaging Manufacturing
KLA’s extensive portfolio of packaging solutions accelerates the manufacturing process for outsourced semiconductor assembly and test (OSAT) providers, device manufacturers and foundries for a wide range of packaging applications. Innovations in advanced packaging, such as 2.5D/3D IC integration using through silicon vias (TSVs), wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP) and heterogeneous integration as well as a wide range of IC substrates create new and evolving process requirements. KLA offers systems for packaging inspection, metrology, die sorting and data analytics focused on meeting quality standards and increasing yield before and after singulation. SPTS provides a broad range of etch and deposition process solutions for advanced packaging applications. Orbotech offers a portfolio of technologies that includes automated optical inspection (AOI), automated optical shaping (AOS), direct imaging (DI), UV laser drilling, inkjet/additive printing and software solutions to ensure manufacture of the highest quality of IC substrates.
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Automated Semiconductor Wafer Optical Inspection and Metrology
SITEview Software
Microtronic SITEview Software is designed from the end-user operator’s perspective and is easy to use, fully featured, and modular. Applications include visual wafer inspection, OCR sorting, wafer defect review, second optical inspection, image storage and retrieval, laser marking, microscope interface, and GEM/SECS II communication and seamlessly integrates with EAGLEview, MicroINSPECT and MicroSORT.
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Circuit Card Assembly
Teledyne Advanced Electronic Solutions assembles and tests a variety of complex circuit card assemblies (CCAs) using leading edge, advanced technology assembly automation. We specialize in low-volume, high-mix assembly of highly complex CCAs.- RF, analog, high-speed and digital circuits on rigid-flex and Cu core substrates- Typical lot sizes from 3 to 300 pieces- 4 high speed, flexible SMT lines- Production processes for components from 0201 chips to large grid-array components and connectors- 100% solder paste, automated optical, and x-ray inspection- Forced air convection reflow with inert atmosphere option- Special processes for RF assemblies (filters, shields, etc)- BGA underfill, conformal coating, etc.- Selective and wave solder pin-thru-hole processes- CCA and component bonding processes
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Atomic Force Microscope
HDM Series
The task of identifying nanoscale defects is a very time consuming process for engineers working with media and flat substrates. Park NX-HDM is an atomic force microscopy system that speeds up the defect review process by an order of magnitude through automated defect identification, scanning and analysis. Park NX-HDM links directly with a wide range of optical inspection tools, thus significantly increasing the automatic defect review throughput. In addition, Park NX-HDM provides accurate sub-angstrom surface roughness measurements, scan after scan. Park NX-HDM, together with its industry's lowest noise floor, and its unique True Non-Contact™ technology, it is the most accurate AFM for surface roughness measurement in the market.
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Advanced Automated Optical Inspection (AOI)
V510i Optimus 3D
V510 has high productivity, the superior detection capability and inductory fastest inspection speed. It is by High Speed Multi Frequency Phase Shift Profile technology and simultaneous inspection method of 2D/3D. V510 can inspect that without influencing the surface condition and the warp of the board by unique lighting technology.By much algorithm, inspevtion of the component smoothness and the very small component is possible.
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Automated Optical Inspection (AOI)
TR7700 SIII 3D
TRI’s ground breaking 3D AOI solution delivers the fastest hybrid PCB inspection combining optical and blue-laser-based true 3D profile measurement for the highest automated defect symptom coverage possible. Integrated state-of-the-art software solution and third generation intelligent hardware platform offer stable and robust 3D solder and component defect inspection and with high inspection coverage and easy programming.
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Automated Optical Inspection System
AV880 Series
The AV880 Series of AOI solutions from ASC International provides the same high level inspection capabilities as found in our AV862/AV871 Series of AOI systems all wrapped into an inline platform for continuous flow requirements. A price to performance ratio sure to please those looking for a quick ROI.
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CMOS Dual USB3 Cameras
CELERA
CELERA CMOS Dual USB3 cameras provides unrivaled speed, extreme flexibility and quick system integration. Its double USB3 interface, ultra-fast acquisition rate, extremely reduced dimensions and rugged design make CELERA cameras suitable far the most demanding applications: automated optical inspection, high performance sorting systems, industrial metrology, microscopy, medical diagnostics and machine vision. CELERA cameras are powered directly by the USB3 bus eliminating the need for external power adapters. USB3 provides the most cost effective and widespread interface, pushing speed performances at the top.
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Encoder | Trigger Board
ADLINK encoders and trigger boards are widely used in centralized motion controllers, supporting real-time encoder feedback as well as position comparison and high-speed trigger output functions for better motion control accuracy. Encoder and trigger cards are ideal add-on options when positioning comparison points on motion cards are insufficient. ADLINK encoder and trigger cards provide PCI/PCIe interfaces and 14 built-in comparators, providing flexible output and input modes suitable for applications with high requirements for distance measurement such as high-speed advanced scanning and automated optical inspection.
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Batch AOI Machine
Sherlock-300B
Compact Sherlock 300B batch PCB inspection (AOI) system provides manufacturers with the benefits of inline AOI—hands-off board handling, automatic good/bad board sorting and minimal operator interaction—in the convenience and flexibility of a standalone AOI station that can be located anywhere in the facility and used to process boards from multiple production lines, including production lines that aren't inline/automated, such as smaller and benchtop lines. With an average cycle time of 10 seconds per board (including transport), Sherlock 300B automated optical inspection (AOI) machine can be used for everything from first article to 100% inspection for increased quality and production yields. (Cycle time measured using a 7.3" x 5.1" (185 x 130 mm) PCB with 253 parts.)
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Automated Gage Measurement System
AGMS
Our Automated Gage Measurement System for Sand Screen (AGMS) provides accurate and repeatable optical measurements for all wire-wrapped gaps along the full screenlength. This inspection machine enables oil field sand screen manufacturers to meet the measurement requirements of API Spec 19S1 and ISO 17824:2009.
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Test Solutions Services
Spinnaker Contract Manufacturing, Inc.
As standard practice, all of our SMT assemblies are washed and tested through our Automated Optical Inspection and pass through our stringent internal QA/QC policies. In Cables and Wire Harnesses, pretests, such as pull tests and crimp type tests, are performed on all builds before being tested for continuity, hi-pot, shorts and mis-wires, to name a few. Our electromechanical assemblies are capable of receiving full functional testing through custom test fixtures and RF test. Some RF tests include Gain/Loss, Frequency Response, VSWR (Voltage Standing Wave Ratio), Inter-Modulation Distortion and Output Power.
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2D Automated Optical Inspection Systems (2D-AOI)
BF1 Series
Saki’s unique line scanning technology and coaxial overhead lighting enables high-speed accurate inspection.