Aries
Aries Electronics is a leading manufacturer of a broad range of interconnect products and Correct-A-Chip™ technology. Our website contains over 200 full-spec Product Data Sheets available for viewing, downloading, and printing.
- 215-781-9956
- info@arieselec.com
- 2609 Bartram Road
Bristol, PA 19007-6810
United States
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product
44-Pin 0.8mm QFP-to-44-Pin PLCC Adaptor
44-305263-20
44 Pin .8mm QFP to 44 Pin PLCC Adapter. cost effective means of upgrading to QFP without changing your PCB layout.
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product
Yellow Streak Jumpers on 0.100 [2.54] Centers
Series 154
Yellow Streak Jumpers on .100 [2.54] Centers. A low-cost jumper available with (Series 154YP) or without (Series 154YS) pitch bars.
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product
PLCC-to-DIP Adaptor
Series 652000/653000
PLCC to DIP Adapter. Converts PLCC packaged ICs to DIP footprints. Ideal for prototyping and testing/evaluation. Available with PLCC sockets or PLCC pads on top side. Consult factory for panelized form or for mounting of consigned ICs.
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product
Standard DIP Socket with Solder Tail Bifurcated Contacts
Series 511
Standard DIP Sockets with Wire Wrap Bifurcated Contacts. Features: Standard DIP sockets are available with solder tail or wire wrap pins, all with bifurcated contacts. Consult Data Sheet No. 12005 for wire wrap pins. Aries offers these standard DIP sockets in more sizes than any other manufacturer.
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product
DIP Header with Coined Contacts
Series 600
DIP Headers with Coined Contacts. Aries offers a full line of DIP headers, available with either coined or screw machine contacts. Consult Data Sheet No. 12035 for screw machine contacts. Snap-on, protective covers are available for all sizes shown below and accommodate .125 [3.18] to .750 [9.05] component heights. Consult Data Sheet No. 12033 for protective covers.
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product
20-Pin PLCC-to-16-Pin DIP Adaptor
16-304633-18
20 PIN PLCC TO 16 PIN DIP ADAPTER FOR MOTOROLA MC12009 AND OTHERS. A cost effective means of upgrading to PLCC Package without changing your PCB layout.
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product
Universal SOIC ZIF (Zero-Insertion-Force) Test Socket
Series 547
Universal SOIC Zero Insertion Force Test Socket. Devices with up to 44 pins can be inserted without bending or otherwise damaging the legs, since no force is required to either insert or remove the component from the socket. Accepts SOIC gull-wing and J-lead devices, up to 44 pins on .050 [1.27] lead pitch, body widths from .150 to .600 [3.81 to 15.24].
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product
QFP-to-PGA Motorola DSP56000/001 Adaptor
97-56001
QFP to PGA Adapter for Motorola DSP56000/001. Convert surface mount QFP packages to a 13 x 13 PGA footprint. Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.
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product
PLCC-to-DIP Adaptor
1109342
PLCC to DIP Adapter for Intel 80C31BH, 80C51BH, 87C51, 80/83C652 ,80C251 and other Microprocessors. Designed specifically for use with Intel 80/83C652 and 80C251 microprocessors.
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product
Universal PLCC ZIF (Zero-Insertion-Force) Test Socket
Series 537
Universal PLCC ZIF Test Socket Live Bug Type. This Universal PLCC ZIF (zero insertion force) Test Socket will take seven sizes of PLCC footprints with Aries insert plate, Part No. XX-537-20. Data Sheet No. 10012, available seperately.
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product
Pin-Line™ Header with Screw Machine Contacts
Series 0625
Pin-Line Headers with Screw Machine Contacts. Aries Pin-Line headers are available with a variety of screw machined contacts. Consult Data Sheet No. 12034 for strip-line headers with coined contacts. Break feature allows header to be cut to the number of positions desired.
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product
SOIC DW-to-20-Pin PLCC
MC145158-2
ADAPTER FOR MOTOROLA. FROM PLCC 20 PIN FN PACKAGE TO SOIC DW PACKAGE. A cost effective means of upgrading to SOJ or SOIC ... without changing your PCB layout.
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product
Lo-PRO®file ZIF (Zero-Insertion-Force) Socket
Series 526
LO-PRO file Zero Insertion Force Socket. A choice of 24, 28, or 40 pin count devices can be inserted without bending or otherwise damaging the legs, since no force is required to either insert or remove the component from the socket. A metal cam provides strong, smooth action as it moves to a positive stop, compressing the double-sided contacts, ensuring a gas-tight seal.
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product
Test & Burn-In Socket for Devices up to 13mm Square
CSP/MicroBGA
Test & Burn-In Socket. Socket is easily mounted and removed to & from the BIB due to solderless pressure mount compression spring probes which, are accurately located by two molded plastic alignment pins and mounted with four stainless steel screws. Standard molded socket format can accommodate any device package of 13mm or smaller, by using machined (for small quantities) or custom molded (for large quantities) pressure pads and interposers.
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product
DIP-to-SOIC Adaptor
Series 354000
DIP to SOIC Adapters. Convenient, cost-effective means of converting DIP style packaging to SOIC PC board layouts.
